You will be updated on current and future technology solutions. You will get projections as to where advanced packaging techniques are headed both in design and manufacturing. This seminar will serve as an invaluable tool for you in crafting your business and technical strategies.

Connect with innovative technologists, business managers and other industry leaders - this will be an excellent opportunity to meet and exchange ideas with peers. Join your colleagues in charting the future direction of the electronic interconnection and packaging industry. Stay ahead of the curve with this unique event!

To register for the upcoming IPC Seminar on Future Advanced Packaging Technology, please cut and paste www.ipc.org/AdvPack0608<http://www.ipc.org/AdvPack0608> into your browser.

Don't miss out on the upcoming Design for Advanced Packaging Workshop hosted by Tessera Inc. on June 3-4, 2008 in San Jose, Calif.

To register for the upcoming IPC Design for Advanced Packaging workshop, please cut and paste http://www.ipc.org/calendar/2008/DesignForAdvancedPackagingWorkshop062008/DFAP.htm into your browser.

If you have any questions, please feel free to contact Michelle Michelotti at +1 847-597-2822 or via email at [log in to unmask]<mailto:[log in to unmask]>


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