Hi All,

I am looking for a source for a ceramic interposer to attach a die to a flex
circuit. What I know so far is the ceramic will probably be 4 layers, total
thickness .010,  vias to be filled, vias - .012 pad, 1056 BGA balls on the
bottom (63/37 tin-lead), 1056 pads on the top, pad pitch .0302 in the Y,
.03686 in the X. Annual volume in the 30K range once we get through
prototypes and pre-production. Medical application. Thanks in advance.
Regards Steve Kelly

 

Steve Kelly

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)

 


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