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May 2008

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Fri, 23 May 2008 13:01:33 -0700
Content-Type:
text/plain
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text/plain (78 lines)
Ioan Tempea:
Is the mask covering both bare laminate and Copper?  Is there a difference in removal difficulty bare board vs. exposed Copper?
If the exposed Copper is the big problem, I strongly suspect that treating bare Copper with a good anti-tarnish might extend strip time window.

Rudy Sedlak
RD Chemical Company


--- On Fri, 5/23/08, Ioan Tempea <[log in to unmask]> wrote:

> From: Ioan Tempea <[log in to unmask]>
> Subject: [TN] Water soluble masking
> To: [log in to unmask]
> Date: Friday, May 23, 2008, 12:52 PM
> Dear Technos,
> 
>  
> 
> I am testing WS solder masking substances and what I see is
> that they
> wash perfectly if relatively fresh (barely cured or after a
> couple of
> hours on the board) and they wash very poorly if passed in
> the in-line
> machine 24 or 48 hours after the application.
> 
>  
> 
> Is this natural? What is your experience?
> 
>  
> 
> Chemtronics have a note on the bottle requesting washing
> within 48
> hours, nothing marked on the Techspray bottle, but both are
> very
> difficult to remove after 24 hours.
> 
>  
> 
> Thanks,
> 
>  
> 
> Ioan
> 
> 
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