That's a good answer for any day of the week. It depends
Joyce,
That's a good answer for any day of the week. It depends... also on how
good is your rework process.
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, May 23, 2008 1:56 PM
To: [log in to unmask]
Subject: Re: [TN] Methodology for determining the # of reworks ENIG
finished solder lands for leaded components can withstand
It depends... how good is your ENIG?
Sorry, it is Friday...couldn't resist...jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Macko
Sent: May 23, 2008 1:41 PM
To: [log in to unmask]
Subject: [TN] Methodology for determining the # of reworks ENIG finished
solder lands for leaded components can withstand
Techs,
I am looking for some help / guidance on how to analytically determine
the number of times the same leaded component can be replaced on a ENIG
finished board before the solder lands located on the PCB have been
degraded beyond their capability to provide a solderable class 3 surface
(.e., how many times can the ENIG finished solder lands with stand a
rework/component remove & replace). I suspect the dissolution rates of
nickel and copper come into play however I am not sure how to approach
this issue and suspect there are some relatively straightforward
formulas out there to accomplish this task. Everyone has a different
idea and there are numerous rules of thumb discussed but I would like to
try something more analytical (without having to use a supercomputer).
Thanks again and everyone enjoy the long weekend.
Best Regards,
-joe
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