It depends... how good is your ENIG?
Sorry, it is Friday...couldn't resist...jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Macko
Sent: May 23, 2008 1:41 PM
To: [log in to unmask]
Subject: [TN] Methodology for determining the # of reworks ENIG finished
solder lands for leaded components can withstand

Techs,

 

I am looking for some help / guidance on how to analytically determine
the number of times the same leaded component can be replaced on a ENIG
finished board before the solder lands located on the PCB have been
degraded beyond their capability to provide a solderable class 3 surface
(.e., how many times can the ENIG finished solder lands with stand a
rework/component remove & replace).  I suspect the dissolution rates of
nickel and copper come into play however I am not sure how to approach
this issue and suspect there are some relatively straightforward
formulas out there to accomplish this task. Everyone has a different
idea and there are numerous rules of thumb discussed but I would like to
try something more analytical (without having to use a supercomputer).
Thanks again and everyone enjoy the long weekend.

 

Best Regards,

-joe

 


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