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May 2008

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Subject:
From:
John Maxwell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Maxwell <[log in to unmask]>
Date:
Fri, 2 May 2008 11:46:00 -0700
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Ah reminds me of when I worked at National Semi many moons ago and 
they introduced DEDs or Dark Emitting Diodes to increase the LED 
yield to 100%. I suppose that one could get some measurements of the 
speed of dark using DEDs.

John Maxwell

At 11:40 AM 5/2/2008, you wrote:
>With that inspiration it begs one to ponder "what is the speed of dark"
>and with voids in the hole "what ever happened to preparations A through
>G".
>Dewey
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
>Sent: Friday, May 02, 2008 11:23 AM
>To: [log in to unmask]
>Subject: Re: [TN] Voids in internal PCB microvias
>
>Hi Bev,
>
>Backfire ... by all means.
>
>Your subject line says "Voids in internal PCB microvias"
>
>Your customer wants to know the composition of a void in a buried
>microvia.
>
>I think what you have posted is a PCB koan. A classic koan by Hakuin is
>"You know the sound of two hands clapping. What is the sound of one hand
>clapping"
>
>PCB koan - "You know the composition of what fills a filled microvia.
>What is the composition of what fills a voided microvia?"
>
>The important part of the microvia is the part where there is no
>microvia because that's the part that contains the void.
>
>This is the yin and yang of the what is, and what is not, in a microvia.
>
>
>Grasshopper, this is the Tao of PCBs.
>
>Paul Reid, PCB Inc.
>
>PS. I would just look at the RIM of the void.
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
>Sent: Friday, May 02, 2008 12:54 PM
>To: [log in to unmask]
>Subject: [TN] Voids in internal PCB microvias
>
>TechNetters,
>I have a customer who wants to know the composition of any materials (if
>any) inside copper plated internal microvias.  Obviously traditional
>x-sectioning would lead to contamination by the x-sectioning process.
>Someone suggested laser cutting, but that is ridiculous, for the same
>reason.  Someone else suggested FIB, but this is fiendishly expensive,
>especially for the kind of depth of cut we might be talking about here.
>
>Any and all non-Friday afternoon suggestions welcome.
>(This last statement will probably backfire on me!) Bev RIM
>
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