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May 2008

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Subject:
Re: 0402 anti-tombstoning land pattern
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Thu, 22 May 2008 08:05:28 -0400
Content-Type:
text/plain
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text/plain (47 lines) 
Hi Richard,

Here's what I recommend to our customers and works very well, I have assembled thousands of boards with hundreds of 0402s each with practically no tombstoning. It is actually a collection of thoughts found on Technet over the years.

- 0.023"x0.023" pads, with a 0.014" gap
- The traces attached to the pads should be routed from the pad along the component axis for at least 7 mils, then routed as per designer's needs
- The traces attached to each pad have to have the same width
- The pads included in copper planes have to have thermal relief
- The stencil is cut square 0.021", no homeplating

Good luck,

Ioan

-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Stadem, Richard D.
Envoyé : May 21, 2008 5:26 PM
À : [log in to unmask]
Objet : [TN] 0402 anti-tombstoning land pattern

I am trying to find an 0402 land pattern that is optimum from the
standpoint of fixing tombstoning issues in a leaded convection reflow
process. If anyone has a pattern that works feel free to send it to me
offline.
Thanks
Richard

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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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