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May 2008

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Subject:
Re: 0402 anti-tombstoning land pattern
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Thu, 22 May 2008 08:19:16 +0300
Content-Type:
text/plain
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text/plain (63 lines) 
Hi Werner,

I have designed an evaluation board and found that round pads are better that square pads for 0402.

Best Regards


Reuven ROKAH

e mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, May 22, 2008 12:51 AM
To: [log in to unmask]
Subject: Re: [TN] 0402 anti-tombstoning land pattern

Hi Dean,
Make the land pattern narrower than the component-I know, I know, tough to do
with 0402's as well as shorter thus producoing less of a fillet [which is ,of
course, the root cause for the tombstoning]

Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17,
London
Pb-Free Soldering Processes-Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture,
ENIG), September 22, Schaumburg



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