Hi Bev,
I think it can be done relatively easy.
Try to parallel lap the board from the bottom side of the microvia all
the way down to the Cu layer, the via is attached to. Once the layer is
exposed, you can try to simply pill it off and if it works (and I don't
see why it wouldn't), then you'll see inside the via.
Good luck,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Friday, May 02, 2008 12:54 PM
To: [log in to unmask]
Subject: [TN] Voids in internal PCB microvias
TechNetters,
I have a customer who wants to know the composition of any materials (if
any) inside copper plated internal microvias. Obviously traditional
x-sectioning would lead to contamination by the x-sectioning process.
Someone suggested laser cutting, but that is ridiculous, for the same
reason. Someone else suggested FIB, but this is fiendishly expensive,
especially for the kind of depth of cut we might be talking about here.
Any and all non-Friday afternoon suggestions welcome.
(This last statement will probably backfire on me!)
Bev
RIM
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