Dave,
The customer was the one that originally suggested lasers and FIB in
their test request, so that path already has been trod.
Bev
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, May 02, 2008 1:55 PM
To: TechNet E-Mail Forum; Bev Christian
Cc: [log in to unmask]
Subject: Re: [TN] Voids in internal PCB microvias
Hi Bev! Several thoughts come to mind but this is a family oriented
forum. Turn the table on the request - ask the customer what analytical
technique they suggest! Their request is not a simple analytical
situation.
Dave Hillman
Rockwell Collins
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Bev Christian <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/02/2008 11:53 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Bev Christian <[log in to unmask]>
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Subject
[TN] Voids in internal PCB microvias
TechNetters,
I have a customer who wants to know the composition of any materials (if
any) inside copper plated internal microvias. Obviously traditional
x-sectioning would lead to contamination by the x-sectioning process.
Someone suggested laser cutting, but that is ridiculous, for the same
reason. Someone else suggested FIB, but this is fiendishly expensive,
especially for the kind of depth of cut we might be talking about here.
Any and all non-Friday afternoon suggestions welcome.
(This last statement will probably backfire on me!)
Bev
RIM
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