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May 2008

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Mon, 19 May 2008 09:00:02 -0400
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text/plain
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text/plain (56 lines)
Ashok,

Looks like you answered your own question.
20 mil pad design - (2.5 mil etch x 2 sides) = 15 mil pad actual > 10
mils 

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ashok Dhawan
Sent: Thursday, May 15, 2008 9:05 PM
To: [log in to unmask]
Subject: [TN] Solder Pad width

I am looking for measured pad width for 20 mil land pattern for SMT.
(QFP or TSOP) 

What is Pad width actal versus top copper layer?  Copper outer layer is
1 oz or 2 oz or 3 ozs. 

Reason for this question: Stencil is 6mils thick with min aperture
opening of 9 mils. For gasketing, the pad need to o=be over 10 mils. 

2 Ozs copper has etch factor 2.5 mils over etch each side. Can final pad
width of over 10 mils be made.

Any inputs on this will be appreciated.

Regards


Ashok

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