Neil

If you are speaking of an immersion process, then gold forms a very weak 
bond to copper although some are trying to enhance the basic bond. In that 
case I would certainly place a nickel layer between the gold and copper 
which is normal in ENIG plating.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389



----- Original Message ----- 
From: "[log in to unmask]" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 02, 2008 2:01 AM
Subject: [TN] Fw: [TN] Brittle FPC Tracks


> OK, can anyone confirm this theory:
> Au over Cu means the Cu can diffuse into the Au
> Cu-Au alloy is very brittle
> Therefore I am seeing a very brittle FPC...?
> If this is the case, would a Ni barrier layer solve the problem?
> I am sure someone out there can answer this one and has been there, done
> that, got the T Shirt...
> (Mr Engelmaier usually has good answers to these types of questions...)
>
> Neil
>
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