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May 2008

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Subject:
From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Thu, 15 May 2008 16:07:50 -0500
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Register today for the upcoming IPC/Jisso Advanced Interconnect Technology Solutions
2nd Jisso International Forum
May 21-22, 2008
Hosted by Georgia Institute of Technology

IPC and the Jisso International Council (JIC) are sponsoring a technical seminar, May 21-22, 2008, to provide information on the latest trends in interconnection technologies used in electronic products. The seminar will be held in conjunction with the 2nd Jisso International Forum being hosted by Georgia Institute of Technology. Members of JIC, as well as technology leaders from industry will be speaking on environment-friendly manufacturing, three-dimensional integration, interposer substrates, and standards activities.

SESSION TOPICS INCLUDE:

Overviews of major areas of the total packaging solution

The total package solution by Jisso level

Reliability and quality

Energy conservation and generation
Nano materials
Printed and embedded electronics
SiP, TSVs and 3-D packaging



Attendees will get a comprehensive view of both integrated electronics development and manufacture; in addition to valuable inputs on interconnect technologies that will impact the electronics industry over the next ten years. If you want to gain a comprehensive understanding of the key issues in electronic interconnections, this seminar is a must.


To register for the IPC/Jisso Advanced Interconnect Technology Solutions Forum, please cut and paste www.ipc.org/JF0508<http://www.ipc.org/JF0508> into your browser.  If you have any questions about the IPC/Jisso event, please contact Michelle Michelotti at +1 847-597-2822 or via e-mail [log in to unmask]<mailto:[log in to unmask]>




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