It is also important to look at your vias if there is a layer change on
a high current trace. Larger vias, and multiple vias are often needed
for high currents. You can calculate via internal surface area from
board height and diameter. Thickness is probably plating, but you all
know that better than me!
Curt
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Donald Kyle
Sent: Thursday, May 15, 2008 7:26 AM
To: [log in to unmask]
Subject: Re: [TN] Trace thickness/width for power application
Eva,
using the equation in IPC-2221A, which is quite conservative,
assuming the conductor is on the outside, 300 mils wide, 2.7 mils thick,
at 10 amps the temperature rise would be 3 degrees C.
Using the same equation, the same conductor on the inside would have
a temperature rise of 14.5 degrees C.
If there are other high current carrying conductors nearby, they
should be taken into account as they will contribute to the
temperature rise of the board and conductors.
Now, if you are designing something that is UL listed, then there are
other issues that need to be taken into account.
Hope this helps
Donald Kyle
At 04:22 PM 5/14/2008, you wrote:
>Technetters,
>
>We currently don't have a copy of IPC-2221 or any of the other
>design standards. We are designing a power application PCB 120v <
>10A through a trace that is .3" wide by 1.2 long (.150" from one PTH
>to another on both sides)with 2 oz copper on FR4/G10 .062". The
>board will be conformally coated after assembly with Dymax/UV cured
>CC that withstands 500V at 10 mils thickness.
>
>Question: Are these traces wide and thick enough to dissipate the heat?
En
>
>Thanks in advance
>
>Eva Jones
>
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