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Subject:	Re: Pb-Free BGAs on a SnPb board
From:	Raye Rivera <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Raye Rivera <[log in to unmask]>
Date:	Fri, 2 May 2008 09:48:23 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (23 lines)

Craig,

I found this application note from ST Micro instructive on reliability of mixed 
chemistry BGAs. 

http://www.st.com/stonline/products/literature/an/10791.pdf

Reliability is definitely compromised if you don't get complete melting of SAC 
balls, but the risk is much higher if end use application is subject to thermal or 
mechanical shock.  Underfill might improve reliability.

Raye

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