Hi Ioan,
The technical advantages are real—you can solder at much lower peak
temperatures, because the whole assembly reaches that temperature with significantly
smaller thermal gradients initially and none at all at solder reflow.
This is in significant contrast to either IR or convection reflow, because in
both these cases the heat source is at temperatures significantly above what
your assembly can tolerate—so time is a significant factor and thermal
gradients as well.
For assemblies with smaller components only, that may not make much of a
practical difference, but if your assembly is paced by components with larger
thermal masses, e.g., BGAs, the difference is one of properly wetted solder joints
everywhere vs. SJs with insufficient heat to properly form in the middle of
the BGAs, or if properly formed have had the PCB and/or components hot enough
for serious damage.
Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17,
London
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture,
ENIG), September 22, Schaumburg
**************
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