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May 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 12 May 2008 10:09:00 -0500
Content-Type:
text/plain
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 Ioan,
There are now new chemicals used for VP soldering and this, plus the
resurgent interest in a uniform heating technology (especially for
lead-free solders) has spurred new interest in the process. We use VP
for a number of applications and it works well for us. In fact, very
well.
I have attached information on a seminar for anyone interested in
learning more about this technology.
I saw a VP REWORK station at APEX that we are looking into also.
Please note the comments in the abstract below about the new fluids now
available.


Upper Mid-west Chapter of SMTA is sponsoring a Vapor Phase Reflow
discussion. 

If you are interested in Vapor Phase Reflow and how it helps eliminate
gradient heating across the SMT assembly, then this seminar is a must
see.
Please RSVP at the bottom of this e-mail. 

The topic of this seminar is "Application of Vapor Phase Technology".
Gradient
temperature across a circuit board in reflow is not a new factor for
manufacturing using convection ovens but is more significant with the
introduction of lead-free processing when it comes to max temperatures
of
components. We have 2 speakers on tap for this discussion and they are: 

David Suihkonen 
R&D Technical Services, Inc 

Anthony Primavera, PhD 
Boston Scientific 

Date: Tuesday, May 20th, 2008 
Cost: $20 Members / $30 Non-members 

Special Bring a Non-member promo: 
All non-members that become members for this event are automatically in
the
drawing for an IPOD and get the reduced rate for attendance with this
event.
Another drawing for a second IPOD is for the existing members that
attend. 

Location: Hennepin Technical College, Eden Praire Campus 
RSVP: Click link at bottom of e-mail. 

Time/Agenda: 
* 1:30 to 2:00 PM - Registration 
* 2:00 to 2:45 PM - David 
* 3:00 to 3:45 PM - Anthony 

Address/Directions to Hennepin Technical College: 
Eden Prairie Campus 
13100 College View Drive 
Eden Prairie, MN 55347 

From 494 South: 
Exit from 494 at Valley View Road. At the top of the ramp, go left.
Follow
Valley View Road to Highway 212 West. Proceed south on Highway 212 West
approximately 2.5 miles. Turn right at College View Drive proceed to
Eden
Prairie Campus. 
Building J 

From 494 West: 
Exit from 494 at Highway 212 west. Proceed south on Highway 212 west
approximately 2 miles. Turn right at College View Drive proceed to Eden
Prairie
Campus. 
Building J 

Abstract: 
Complex, multilayer and heavy back plane circuit boards have been
soldered
using condensing vapor reflow technology for many years. However, Vapor
Phase
is finding new life in many applications where thermal uniformity,
control of
peak reflow temperatures, and lower peak temperatures for lead free
soldering
are required. In-line reflow soldering is currently dominated by
convection
furnaces as they provide good thermal process capabilities at a
reasonable
price, and high through put. One disadvantage, however, is that a
temperature
gradient occurs between small and large devices, area array components,
components with a high thermal mass, and for many other reasons. As the
high
reliability industry is moving towards lead free soldering, and the
drive to
have better process controls in many applications, the need to reduce
the
temperature gradient across a product increases. As in many things,
what's old
is new again. Vapor phase soldering, which was a soldering standard
process for
many years, fell out of favor due to higher cost, the use of Freon and
other
CFC based chemistry, and batch processing. Vapor phase soldering,
however, is
being examined closely by many industries today, as an alternative to
convection reflow for high reliability applications, such as medical
electronics, military, avionics, high end telecommunication and
automotive. In
part, many of the technology detractors, have been overcome or
eliminated.
Several companies are now offering commercially available, in-line fully
contained vapor reflow systems. Additionally, CFC based chemistry has
been
replaced by PFPE based inert fluids produced by 3M, Dupont, and Galden.
The new
systems are now designed such that the reflow vapor is self contained
inside a
sealed chamber, and all systems recover a substantial portion of the
vapor into
condensed fluid. The main advantage of vapor phase reflow is the
uniformity of
temperature across the entire assembly. As the fluid condenses on the
surface
of the PCB and components, the latent heat of condensation gives off all
the
reaction energy to heating the surfaces. This phase change occurs at the
specific temperature of the fluid's boiling point. Temperature gradients
of
under 5 degrees are common with 1 degree possible. Vapor phase reflow
technology, and the advantages are discussed in these presentations.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, May 12, 2008 8:24 AM
To: [log in to unmask]
Subject: [TN] Vapor phase

Dear Technos,

 

I would like to get your expert opinion on the latest developments in
the vapour phase technology. The last time this topic has been discussed
here this was still an environmental hazard.

 

Here's the latest sales pitch:

 

Dear Convection Oven Users:

With Energy Costs Skyrocketing, You have a cheaper, efficient, and a
better yield Alternative!!

Low Operating Cost, 110 Volt Machine, Run Lead and Lead Free
Sequentially!! 

High Yield, Run your Lead Free Boards at 230 Degrees Uniform Temperature
Distribution, No Circuit Board Delamination, Uses Environmentally
Friendly Teflon 2 Liquid No Hazardous Florocarbons!

 

The questions are:

*       Are the advantages real, should I prefer vapour phase over
convection in day by day reflow operations, from the technical point of
view?

*       Would the technology finally be environmentally friendly?

 

Thanks,

 

Ioan

 


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