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May 2008

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Subject:
From:
Mike Fenner <[log in to unmask]>
Reply To:
Date:
Mon, 12 May 2008 15:49:45 +0100
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I leave the environmental questions to others better qualified.
I like VPR as a concept, it's an elegant idea, but I think it is in danger
of being over sold.
You need to speak to individual suppliers. 
The guy equating low voltage with low operating cost would not be high on my
list. 
Vapour phase make a sense if you are soldering big, heavy and/or complex
shape assemblies where the uniform heat delivery is advantageous. Or if you
are high mix low volume (prototyping ) as it is hard to get it wrong.
Its also an excellent adhesive cure oven as the rapid rise rate possible
gives good cross linking.
The claims made for low delta at peak reflow are true as it is an
equilibrium process, however everyone who has profiled an oven knows there
is more to it that just getting the peak temperature right. The way that VPR
machines adjust the ramp rate from its natural 50C/sec in a full saturated
tank, is machine specific, and need s to be checked out. Verify individual
suppliers. Also some of the claims made are contradictory on some machines.
You can have about 100ppm oxygen in reflow zone if you fully saturate it for
some time with vapour, or you can have a slow ramp. I also suggest check the
second board not just the first. some machines will take time to
re-stabilize.




Regards 

Mike


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, May 12, 2008 2:24 PM
To: [log in to unmask]
Subject: [TN] Vapor phase

Dear Technos,

 

I would like to get your expert opinion on the latest developments in the
vapour phase technology. The last time this topic has been discussed here
this was still an environmental hazard.

 

Here's the latest sales pitch:

 

Dear Convection Oven Users:

With Energy Costs Skyrocketing, You have a cheaper, efficient, and a better
yield Alternative!!

Low Operating Cost, 110 Volt Machine, Run Lead and Lead Free Sequentially!! 

High Yield, Run your Lead Free Boards at 230 Degrees Uniform Temperature
Distribution, No Circuit Board Delamination, Uses Environmentally Friendly
Teflon 2 Liquid No Hazardous Florocarbons!

 

The questions are:

*       Are the advantages real, should I prefer vapour phase over
convection in day by day reflow operations, from the technical point of
view?

*       Would the technology finally be environmentally friendly?

 

Thanks,

 

Ioan

 


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