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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Sat, 10 May 2008 13:26:13 -0400
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Theoretical prediction and experimental measurement of the degree-of-cure of anisotropic conductive film (ACF) for chip-on-flex (COF) applications



Chang-Kyu Chung,   Yong-Min Kwon,   Il Kim,   Ho-Young Son,   Kyo-Sung Choo,   Sung-Jin Kim,   Kyung-Wook Paik,   

Dept. of Materials Science and Engineering, Korea Advanced Institute of Science & Technology 373-1, Gu-seong dong, Yu-seong gu, Daejeon, 305-701, Korea

This paper appears in: Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on 

Publication Date: 19-22 Nov. 2007 

On page(s): 1 - 8 

Number of Pages: 1 - 8 

Location: Daejeon, Korea 

ISBN: 978-1-4244-1909-8 

Digital Object Identifier: 10.1109/EMAP.2007.4510313 

Posted online: 2008-05-02 16:57:29.0 

 

 

 

 

Abstract

The degree-of-cure of an anisotropic conductive film (ACF) was theoretically predicted and experimentally measured to investigate the effect of the degree-of-cure of the ACF on the electrical and mechanical stability of ACF joints and the reliability of COF assemblies. The cure reaction of the ACF observed by isothermal DSC analysis followed an autocatalytic cure mechanism, and the degree-of-cure of the ACF as functions of time and temperature was mathematically derived from an autocatalytic cure kinetics model. To accurately simulate the ACF temperature field during COF bonding process, the thermal properties of the ACF such as thermal diffusivity (α), specific heat capacity (Cp), and thermal conductivity (λ) were experimentally characterized. The degree-of-cures of the ACF as a function of bonding times during COF bonding process were theoretically predicted by the incorporation of the autocatalytic kinetics modeling and the ACF temperature simulation. The predicted degree-of-cures of the ACF were well matched with the experimental data measured by an ATR/FT-IR analysis. The contact resistances of ACF joints and the peel adhesion strengths of COF assemblies were measured to evaluate the electrical and mechanical interconnection stability. According to the results, the contact resistances decreased and the peel adhesion strength increased as the degree-of-cure increased. In addition, to investigate the effect of the degree-of-cure of the ACF on the reliability of COF assemblies, the 85 °C and 85% relative humidity (85 °C/85% RH) test was performed. The results showed that the reliability of COF assemblies also strongly depends on the degree-of-cure of the ACF.  

 

 

 

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-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Tim Mack

Sent: May 8, 2008 4:21 PM

To: [log in to unmask]

Subject: [TN] ACF/ACA Flip Chip Assembly



Hello TechNet,



 



Since tomorrow is Friday I thought I better get this out today. 



 



I have a bare Si flip chip with plated gold bumps that I need to attach to

an ENIG finished FR-4 PCB (the PCB can be changed if ENIG is a bad idea).

My plan is to use Anisotropic Conductive Film/Adhesive (ACF/ACA) to produce

the interconnects.  The chip itself has a 3x4 bump array with a 275 µm

pitch. 



 



Does anyone here know of vendors for this material? Past experience do’s or

don’ts?  Any info would be appreciated.



 



Thanks,



 



Tim Mack



Research Engineer 



NDSU Center for Nanoscale Science and Engineering 



 <http://www.ndsu.nodak.edu/cnse> www.ndsu.nodak.edu/cnse



 



 





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