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May 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 9 May 2008 11:15:56 EDT
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Hi Neil,
No such standard exists or can exist, because [drum roll]—'It depends!'
It depends on thicknees of the layers [each one individually], the modulus of 
elasticity [of each layer—from this the location of the neutral plane is 
determined], and the ductility of each metallic layer [use IPC-TM-650, 2.4.2.1 
"Flexural Fatigue and Ductility, Foil,” or ASTM   E 796 “Standard Test Method 
for Ductility Testing of Metallic Foil”].
Having all of this, you can determine the minimum sustainable bend radius.
You can find the methodology in IPC-D-330, Section 6.2.1.2 “Flexibility 
Considerations in the Design of Flexible Printed Wiring”   [most likely 
out-of-print] or in the upcoming book by Joseph Fjelstad Flexible Circuit Technology, 4th 
edition.

Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17, 
London
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg



**************
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