Chris
I can't add much to Joe's suggestions however what I can add is:
The B52 incorporates some thru-hole connectors so that you can also
run wave soldering if that is part of your process. It is certainly
here that I would first expect there to be any problems.
The B52 has a cousin: the TB57 that features in the International
Standard IEC 61189-5. This was a design that originated at NPL in the
UK and from which Doug "tweaked" to create the B52. He loves to do
that - tweaking that is!
There is a fast growing data set on this and, on behalf of the SIR TG
at IPC, would ask that you share your results with us if you do go
down this route? We can keep it anonymous to protect the innocent....
Kindest regards
Graham Naisbitt
Managing Director
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On 30 Apr 2008, at 20:26, Schaefer, Chris wrote:
> Thanks Joe.
>
> I have yet to see is the B-52 board all surface mount?
>
> Chris
>
>
>
> Chris Schaefer
> Suntron Corporation
> Process Engineer
>
> 800 N. Brutscher Street
> Newberg, OR 97132
> Work Phone: 503.554.6270
> Cell Phone: 785.248.9016
> Email: [log in to unmask]
>
> -----Original Message-----
> From: Joe Russeau [mailto:[log in to unmask]]
> Sent: Wednesday, April 30, 2008 11:09 AM
> To: TechNet E-Mail Forum; Schaefer, Chris
> Subject: Re: [TN] Hand Cleaning Chemistry Qualification
>
> Hi Chris,
>
> Perhaps, I'm reading your post incorrectly, but it comes across (at
> least to
> me) that you are wanting to know what changes you should make to your
> process in order to get the best result from the cleaner. Really, you
> should be focused on whether the cleaner removes the soils left by
> your
> process. If it doesn't, then perhaps it's not the right cleaner.
>
> As for methods, you indicate three techniques that will be of value
> for
> evaluating the cleaner and any residual process residues / chemical
> interactions. Here are a few quick suggestions (take em for what they
> are
> worth):
>
> 1) Select a test vehicle for SIR and/or ECM that closely matches your
> assembly technology. A functional assembly will not work for this
> type
> of testing. The IPC-B-52 would be one good choice. It also has
> breakaway coupons for IC testing. Two drawbacks; 1) it is a little
> expensive and 2) it does not have an extensive data history. Doug
> Pauls
> designed the B-52 and will likely comment. The IC portion of your
> testing could also be done on functional product.
>
> 2) Process the boards as you would normally do. The cleaner needs to
> prove that it can remove your assembly and fabrication residues and
> not
> leave harmful materials behind. If you have several processes and
> materials, choose one that is representative of most of your product
> or
> one that represents a worse-case scenario.
>
> 3) If you are doing any conformal coating, then it may be advisable to
> also to include thermal shock, just to verify that adhesion and
> coating
> properties do not change as a result of this new cleaner.
>
> 4) Visual inspections should be done.
>
> 5) I would also suggest doing a comparative study to your current
> material.
> This will allow you to evaluate how the new stuff compares with the
> stuff your replacing.
>
> 6) If you use ROSE testing to monitor the process on a regular
> basis, it
> would be a very good idea to include this as part of your test matrix.
> I would suggest processing enough samples to do ROSE testing (use your
> own tester), along with the IC, SIR and or ECM. This will help you
> establish a baseline for your ROSE tester while qualifying the new
> cleaner at the same time.
>
> 7) Always, always, always, send samples of the unprocessed boards and
> components to act as controls. If I had a nickel for every test I've
> seen where the customer doesn't include the unprocessed boards, I'm
> sure
> I could almost pay off my diet Mt. Dew tab to Doug.
>
> Anyway, just a few thoughts to help get the ball rolling. I'm sure
> others will comment and make suggestions.
>
> Best Regards,
>
> Joe Russeau
> Precision Analytical Laboratory, Inc.
>
>
>
>
>
> ----- Original Message -----
> From: "Chris Schaefer" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, April 30, 2008 12:58 PM
> Subject: [TN] Hand Cleaning Chemistry Qualification
>
>
> TechTeam,
>
> We are in the very beginning stages of starting a conversion from one
> hand
> cleaning solvent to another more effective one. I am curious what
> makes
> the
> most sense in terms of methods to use to qualify as well as what is
> the
> likely
> norm from the industry? We are required to perform SIR or ECM, and IC
> testing
> by various customers prior to any changes which I think is a good
> thing,
> but
> what would be the application process of flux, soldering, and finally
> cleaning?
> As well as the actual soldering and cleaning process. With the various
> geometries, spacing, ground planes, thermal requirements, materials,
> time,
> etc... How would best capture the effectiveness of the new solvent? We
> are
> currently using an RMA 15% solid flux, hand soldering with
> 600-700dgree
> tips
> on multi-layer product from FR4 to teflon. I hope I didn't open a huge
> can-o-
> worms.
>
> Thanks all and have a great day!
>
> Chris
>
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