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May 2008

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Thu, 8 May 2008 13:58:16 -0700
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Tim,

Since this assembly probably wont last very long, the easiest thing to do is to use Sn-Pb solder to "tin" the ENIG on your PCB, clean your site then place your flip chip on the site and send it into a "peaky" Sn-Pb reflow cycle....

That should form theinterconnects you need without all the other issues that ACF/ACA entail and would probably last as long...

Paul

Paul Edwards
Surface Art Engineering

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tim Mack
Sent: Thursday, May 08, 2008 1:21 PM
To: [log in to unmask]
Subject: [TN] ACF/ACA Flip Chip Assembly

Hello TechNet,



Since tomorrow is Friday I thought I better get this out today.



I have a bare Si flip chip with plated gold bumps that I need to attach to
an ENIG finished FR-4 PCB (the PCB can be changed if ENIG is a bad idea).
My plan is to use Anisotropic Conductive Film/Adhesive (ACF/ACA) to produce
the interconnects.  The chip itself has a 3x4 bump array with a 275 µm
pitch.



Does anyone here know of vendors for this material? Past experience do's or
don'ts?  Any info would be appreciated.



Thanks,



Tim Mack

Research Engineer

NDSU Center for Nanoscale Science and Engineering

 <http://www.ndsu.nodak.edu/cnse> www.ndsu.nodak.edu/cnse






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