You need a robust interconnect structure so you want to stay away from the weekend?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tim Mack
Sent: Thursday, May 08, 2008 1:21 PM
To: [log in to unmask]
Subject: [TN] ACF/ACA Flip Chip Assembly

Hello TechNet,

 

Since tomorrow is Friday I thought I better get this out today. 

 

I have a bare Si flip chip with plated gold bumps that I need to attach to
an ENIG finished FR-4 PCB (the PCB can be changed if ENIG is a bad idea).
My plan is to use Anisotropic Conductive Film/Adhesive (ACF/ACA) to produce
the interconnects.  The chip itself has a 3x4 bump array with a 275 µm
pitch. 

 

Does anyone here know of vendors for this material? Past experience do's or
don'ts?  Any info would be appreciated.

 

Thanks,

 

Tim Mack

Research Engineer 

NDSU Center for Nanoscale Science and Engineering 

 <http://www.ndsu.nodak.edu/cnse> www.ndsu.nodak.edu/cnse

 

 


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