Dan,  
 
Being a consultant on a military electronics team, I can say the BGA  
performance very much depends on the board layout, component location, method of  
locking the board in a card frame, use of board stiffeners, solder used, circuit  
board material used (read that Tg 130C or Tg170C epoxy), and a host of other  
factors.  Vibration analysis is pretty complex and certain consultants have  
set up specialties in the subject.  Also, I am of the opinion that most  
military contractors have developed good design models for vibration  environments, 
even though they do not publish much on the subject.  
 
One good place to start to understand vibration on board reliability is the  
JCAA-JGPP project subjecting over 150 identical boards to a variety of thermal 
 cycle, vibration, drop shock, and combined environment stresses.  The web  
site to that report is 
 
_http://acqp2.nasa.gov/projects/LeadFreeSolderTestingForHighReliability_Proj1.
html_ 
(http://acqp2.nasa.gov/projects/LeadFreeSolderTestingForHighReliability_Proj1.html) 
 
and in particular the vibration section written by Tom Woodrow of  Boeing:
 
_http://acqp2.nasa.gov/LFS%20Reliability/VibEMP%20Rev.%20A%20010906.pdf_ 
(http://acqp2.nasa.gov/LFS%20Reliability/VibEMP%20Rev.%20A%20010906.pdf) 
 
Please contact me offline if you need the names of some consulting  
organizations who can help you in your vibration analyses.  
 
Denny Fritz
SAIC, Inc. 
 
*********************************
 
In a message dated 5/8/2008 10:06:34 A.M. Eastern Daylight Time,  
[log in to unmask] writes:

I have  received an inquiry from a customer regarding deflection data. They 
want to  know if there's any data they can input so they can simulate if their 
BGAs  will be ejected off their PCBs in a high vibe environment. The PCB is a 
14  layer FR-4 .062 thick. Any guidance would be greatly  appreciated.







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