IPC-7711 5.3.2 is also a method of installing chips, which is
point-to-point (soldering iron). Both procedure does have a statement
recommending preheating for sensitive components.
Jon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sauer, Steve
(Xetron)
Sent: Thursday, May 01, 2008 6:25 AM
To: [log in to unmask]
Subject: Re: [TN] Rework/touchup of MLCCC chip capacitors and ceramic
chip resistors
The reference that you're looking for is in IPC-7711 method 5.3.1. This
is the only method in 7711 that is cited for manual chip installation.
This method describes the use of solder paste and hot air to install a
chip device. The removal methods, 3.3.1 - 3.3.3, are bifurcated tip,
thermal tweezers and hot air.
Other methods are acceptable as long as the other requirements (ility's)
are met in addition to workmanship.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, April 30, 2008 4:54 PM
To: [log in to unmask]
Subject: [TN] Rework/touchup of MLCCC chip capacitors and ceramic chip
resistors
Werner's mentioning of pad design to prevent chip cracking and other
issues discussed recently had me wondering if hot air rework, whether
done by hot-gas rework machines or by using hand-held hot air stations
such as the Hakko, is required for Class 3 hardware. I thought it was,
but cannot find a reference to it in J-STD-001D, -DS, or in the
Handbook. Therefore I am under the assumption that rework of ceramic
chip caps/resistors using standard solder irons is acceptable, even if
not preferred. Is this true?
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