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May 2008

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Subject:
Re: dye and pry
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 16 May 2008 07:41:36 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines) 
Hi 'gramsey,'
Many socket bodies are made of materials with quite a CTE-mismatch with the 
PCBs to which they are attached.   Given a cyclically varying thermal operating 
environment can result in creep-fatigue failure of the solder attachment. 
Look for IPC-D-279 for an explanation.
Any commercial laboratory should be able to do a 'dye and pry' for you—
cross-sectioning would show the problem even more clearly.

Werner



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