Techs,
I am looking for some help / guidance on how to analytically determine
the number of times the same leaded component can be replaced on a ENIG
finished board before the solder lands located on the PCB have been
degraded beyond their capability to provide a solderable class 3 surface
(.e., how many times can the ENIG finished solder lands with stand a
rework/component remove & replace). I suspect the dissolution rates of
nickel and copper come into play however I am not sure how to approach
this issue and suspect there are some relatively straightforward
formulas out there to accomplish this task. Everyone has a different
idea and there are numerous rules of thumb discussed but I would like to
try something more analytical (without having to use a supercomputer).
Thanks again and everyone enjoy the long weekend.
Best Regards,
-joe
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------