TGASIA Archives

May 2008

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, Li Nora <[log in to unmask]>
Date:
Wed, 21 May 2008 12:02:25 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, yuank0 <[log in to unmask]>
Subject:
Re: 答复: [TGA] L F-HASL板子孔径大于 5mm 的电镀铜皮和孔分离
From:
yuank0 <[log in to unmask]>
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<[log in to unmask]>
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