TGASIA Archives

May 2008

TGAsia@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TGAsia <[log in to unmask]>
Subject:
了解炉温曲线是依据焊锡膏的温度曲线还是主要芯片的温度曲线?
From:
"zhidong.chen" <[log in to unmask]>
Date:
Wed, 7 May 2008 08:48:30 +0800
Content-Type:
multipart/alternative; boundary="=====003_Dragon351172645808_====="
X-To:
"[log in to unmask]" <[log in to unmask]>
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, "zhidong.chen" <[log in to unmask]>
Parts/Attachments:
text/plain (253 bytes) , text/html (1273 bytes)

ATOM RSS1 RSS2