TGASIA Archives

May 2008

TGAsia@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, James Liu <[log in to unmask]>
Date:
Fri, 30 May 2008 11:33:23 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, Wilson Poon <[log in to unmask]>
Subject:
Re: Solder residue found on the bare PCB.
From:
Wilson Poon <[log in to unmask]>
In-Reply-To:
A<[log in to unmask]>
Content-Type:
multipart/related; type="multipart/alternative"; boundary="----_=_NextPart_001_01C8C205.E9E81A15"
MIME-Version:
1.0
Parts/Attachments:
text/plain (22 kB) , text/html (11 kB) , image001.gif (22 kB)

ATOM RSS1 RSS2