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Thu, 8 May 2008 07:20:03 -0700 |
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Look for an SMTA paper
"FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE
FINISH USING 4-POINT BEND TEST" SMTA Pan Pacific
Microelectronics Symposium, Kauai, HI, Jan. 25 – 27, 2005
At 07:03 AM 5/8/2008, Dan Skweres wrote:
>Good day all!
>I have received an inquiry from a customer
>regarding deflection data. They want to know if
>there's any data they can input so they can
>simulate if their BGAs will be ejected off their
>PCBs in a high vibe environment. The PCB is a 14
>layer FR-4 .062 thick. Any guidance would be greatly appreciated.
>Thanks,
>Dan S.
>
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