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May 2008

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TechNet <[log in to unmask]>
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Date:
Wed, 21 May 2008 17:50:52 EDT
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
Re: 0402 anti-tombstoning land pattern
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From:
Werner Engelmaier /* <[log in to unmask]>
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Hi Dean, 
Make the land pattern narrower than the component—I know, I know, tough to do 
with 0402's as well as shorter thus producoing less of a fillet [which is ,of 
course, the root cause for the tombstoning]

Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17, 
London
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg



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