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It depends.
The smaller the aperture, the less paste left on the board.
The thicker the stencil the less paste left on the board.
And then you have your aperture ratio that combines the two.
And then there is which specific paste you are talking about.
Etc., etc.
I would say to be safe - between 0 and 100%. But I think we can say it
is usually between 30 and 90%. I am a lab rat, so process engineers may
be able to refine this a bit.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dan Mathews
Sent: Tuesday, May 20, 2008 12:10 PM
To: [log in to unmask]
Subject: [TN] Average paste volume estimate
Does anyone have an easy way to estimate how much paste is applied to a
smt pcb? I understand it varies on
squeegee pressure, stencil thickness, and pitch of the components but I
was looking for an average. I would
assume that somewhere out there someone can estimate that "2 grams of
paste is used on a 2" x 2" smt pcb".
I will then use this information to determine how much lead is used on
non-RoHS products due to solder paste
issues and not non-compliant components.
Thank You in Advance,
Dan
Dan Mathews C.I.D.+
Engineering Support Supervisor
B&B Electronics
Ottawa, IL USA 61350
Phone: 815-433-5100 ext 217
Fax: 815-434-8831 (direct to my desk)
URL: http://www.bb-elec.com <http://www.bb-elec.com/>
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