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Sender:	TechNet <[log in to unmask]>
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Date:	Fri, 16 May 2008 07:41:36 EDT
Reply-To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:	Re: dye and pry
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From:	Werner Engelmaier /* <[log in to unmask]>
Parts/Attachments:	text/plain (28 lines)

Hi 'gramsey,'
Many socket bodies are made of materials with quite a CTE-mismatch with the 
PCBs to which they are attached.   Given a cyclically varying thermal operating 
environment can result in creep-fatigue failure of the solder attachment. 
Look for IPC-D-279 for an explanation.
Any commercial laboratory should be able to do a 'dye and pry' for you—
cross-sectioning would show the problem even more clearly.

Werner



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