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April 2008

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Thu, 10 Apr 2008 21:35:09 -0500
Content-Type:
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Relevant IPC specs claim that no toe fillet is required for DFN/QFN parts and 
there is no minimum solder joint height.  The only requirement for the joint 
other than alignment/pad size is "evidence of wetting".  How do I get this 
evidence without a toe fillet?  I suppose if I have enough joint height I can 
see under the part like a BGA, but I've never seen a FN part mounted that 
high.

Would be nice if the spec included some pix/examples of this "evidence".

Any recommendations would be very much appreciated.

Thanks,

Wayne Thayer

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