Chris,
Sounds like a large can of snakes.
This would be $ and a lot of work, but you might want to consider
building B52 boards, doing your rework, carry out any normal post rework
cleaning and then running the testing you talked about.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer
Sent: Wednesday, April 30, 2008 12:58 PM
To: [log in to unmask]
Subject: [TN] Hand Cleaning Chemistry Qualification
TechTeam,
We are in the very beginning stages of starting a conversion from one
hand
cleaning solvent to another more effective one. I am curious what makes
the
most sense in terms of methods to use to qualify as well as what is the
likely
norm from the industry? We are required to perform SIR or ECM, and IC
testing
by various customers prior to any changes which I think is a good thing,
but
what would be the application process of flux, soldering, and finally
cleaning?
As well as the actual soldering and cleaning process. With the various
geometries, spacing, ground planes, thermal requirements, materials,
time,
etc... How would best capture the effectiveness of the new solvent? We
are
currently using an RMA 15% solid flux, hand soldering with 600-700dgree
tips
on multi-layer product from FR4 to teflon. I hope I didn't open a huge
can-o-
worms.
Thanks all and have a great day!
Chris
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
