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April 2008

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Subject:
From:
Mike Sewell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mike Sewell <[log in to unmask]>
Date:
Wed, 30 Apr 2008 12:12:09 -0500
Content-Type:
text/plain
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text/plain (80 lines)
I thought there was a minimum thickness in J-STD-001 that allowed you to
skip the gold removal for PTH, but for surface mount gold removal was
always required.

Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist
Sent: Wednesday, April 30, 2008 11:29 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-J-STD-001D @ 3.9.3 GOLD REMOVAL

Dave,

The way I've always interpreted this is if you have a gold component
lead
that is 1" long and you are going to be soldering the bottom .1" of the
lead
into the board then .095" needs to have the gold removed.

KennyB
Ext 43-----Original Message-----
From: David Reed [mailto:[log in to unmask]] 
Sent: Wednesday, April 30, 2008 7:30 AM
To: [log in to unmask]
Subject: [TN] IPC-J-STD-001D @ 3.9.3 GOLD REMOVAL

Recently a customer asked the following question.
Here is his question.
 
 I do have a question of interpretation for you regarding "gold
removal".  
In section 3.9.3 it states that ".....95% of the surface to be solder
....." 
needs to have gold removed.  Failing to achieve the 95% is considered a
class 
3 defect.   

We are having boards with PIH gold plated leads rejected for not meeting
this 
requirement. 

Part of the problem is making the determination as to where and how the
95% 
is measured. 

Can you clarify for us exactly where the 95% is measured on the lead.
 
Before I reply to this engineer I thought to see if you had any input.


Thanks,
Dave

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