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April 2008

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Subject:
From:
Eric Bonatti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric Bonatti <[log in to unmask]>
Date:
Wed, 30 Apr 2008 11:26:02 -0400
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IPC-7351A, if possible use LMC (least material condition).

Eric Bonatti, C.I.D.+
EDA Group Leader
Phone: +1 905 812 6200 xt.3412
Fax: +1 905 812 6301
E-mail: [log in to unmask]
 
Psion Teklogix Inc.
2100 Meadowvale Boulevard, 
Mississauga, ON, L5N 7J9, Canada
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist
Sent: Mon. 28 April 2008 18:18
To: [log in to unmask]
Subject: Re: [TN] Cracking Ceramic Cap

John,

Not being a board designer, what is the recommended pad size and
geometry
for a ceramic 0805?

Thanks,

KennyB

-----Original Message-----
From: John Maxwell [mailto:[log in to unmask]] 
Sent: Monday, April 28, 2008 3:04 PM
To: TechNet E-Mail Forum; Ken Bloomquist
Subject: Re: [TN] Cracking Ceramic Cap

Ken,
Boy this take me back to my capacitor cracking days. It will be nice to 
see what the failures look like but from what has been described is 
consistent with assembly flexure cracking. When I wrote my first paper 
on MLCC crack signatures the great majority of cracks were due to 
assembly handling followed closely be excessive solder joint size. 
Things have not changed in the intervening 20+ years. Big wide solder 
joints and a connector right next door, the perfect recipe for cracks.

John Maxwell



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