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TECHNET  April 2008

TECHNET April 2008

Subject:

Re: Software package to perform fatigue life prediction of solder joints

From:

Joe Fjelstad <[log in to unmask]>

Reply-To:

TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]

Date:

Tue, 29 Apr 2008 13:28:01 EDT

Content-Type:

text/plain

Parts/Attachments:

Parts/Attachments

text/plain (207 lines)

 
The following is from an article written by Jenny Hwang in SMT Magazine in  
2002 that highlights the challenge of modeling solder.  
_http://smt.pennnet.com/display_article/138260/35/ARTCL/none/none/1/Step-3:-So
ldering-Materials/_ 
(http://smt.pennnet.com/display_article/138260/35/ARTCL/none/none/1/Step-3:-Soldering-Materials/) 
 
Joe
Single Model Limitations
Service conditions under which solder  joints must perform in component 
packages and assemblies often involve random  multiaxial stresses that expose them 
to creep ranges as well as cyclic strains.  At this time, sufficient and 
integrated data of solder joint behavior under such  conditions and corresponding 
damage evolution are lacking. Consequently, some  important areas and 
conditions are grossly ignored in the modeling scheme.  
Listed are the areas that either have not been included or are not covered  
adequately. They are, in turn, considered to be the reasons that contribute to  
the limitations of a single model for wider applications:  
1. Effect of initial microstructure  
2. Effect of grain size  
3. Effect of microstructure that is not homogeneous  
4. Change in microstructure vs. external conditions  
5. Multiaxial creep-fatigue  
6. Identification of the presence or absence of crack-free materials at the  
starting point  
7. Size of existing cracks, if present  
8. Effect of interfacial metallurgical interaction  
9. Joint thickness vs. interfacial effect  
10. Damage mechanism (transgranular or intergranular)  
11. Potential damage mechanism shift (from transgranular or intergranular)  
12. Presence or absence of grain boundary cavitation  
13. Effect of fillet geometry  
14. Effect of free surface condition  
15. Correlation of accelerated testing conditions vs. those of actual service 
  
16. Testing condition vs. damage mechanism  
17. Service conditioned to include possible variation in chip-power  
dissipation over time   
18. Ambient temperature change  
19. The number of on/off power cycles  
20. Effect of variations in coplanarity among solder joints.  
Including these areas in modeling is not only overwhelmingly time consuming  
but also information demanding — it is a daunting task. Nonetheless, their  
inclusion is necessary to achieve a model's ultimate utility for predicting  
solder joint service life for specific applications. However, before a universal  
model is validated, combining knowledge and data in conjunction with  
experimentation can produce practically sound systems.  
Dr. Jennie S. Hwang is an SMT editorial advisory board member and  president 
of H-Technologies Group Inc. For a list of references cited in this  article 
e-mail the author at [log in to unmask] 
 
 
In a message dated 4/29/2008 6:03:34 A.M. Pacific Daylight Time,  
[log in to unmask] writes:

David,
If you find software that can really do this, let us all  know!

Are you thinking of Finite Element software like Ansys?   There is
another big contender also with a name starting with A, but it  escapes
me right now.  If your company was a member of the CALCE  consortium,
they also have truncated programs that sort of do the same  thing.

The problem is:
1) The amount of computing power needed
2)  Defining the problem properly
3) A lack of fundamental materials  properties

Good luck!

Bev
RIM

-----Original  Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bruce,  David (GB -
MAV)
Sent: Tuesday, April 29, 2008 4:08 AM
To:  [log in to unmask]
Subject: [TN] Software package to perform fatigue life  prediction of
solder joints



Does anyone know of a software  package to perform fatigue life
prediction of solder  joints.



I need to be able to predict the fatigue life of solder  joints under
different thermal cycling and vibration load conditions. The  PCB will
usually be FR4, the solder tin/lead, the components everything  from
BGA's to chip passives. Ideally I need to provide an estimate on  cycles
to failure.



We are trying to do a comparison exercise  to try and specify the more
reliable component, for example, a chip  capacitor in 0805 or 1206, which
one will be more reliable, from a solder  joint perspective and by what
order of magnitude? And what would the  expected life of the joint be
under different conditions?



We  need to perform this exercise over a range of different types  of
components, using different types of leaded solder and perhaps  with
different board thicknesses. Predictive software would be quicker  and
easier than empirical experiments.



Any  ideas?



Regards



David



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