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April 2008

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Subject:
From:
Bob Willis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Willis <[log in to unmask]>
Date:
Wed, 16 Apr 2008 08:49:45 +0100
Content-Type:
text/plain
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text/plain (123 lines)
I have looked out one of my old PCBs featuring CGA the design rules were as
follows:

Column was 0.018" - 0.020"
Pad size 0.026"
Solder mask 0.030"
Telecommunications application
Convection reflow soldered

IBM and other provide design rules for their packages.

My inspection criteria for these is covered on the BGA Inspection CD-ROM
available from the IPC bookshop. Its also covered on inspection posters
covering optical and x-ray. The CGA I believe is to be covered in the future
in 610 but nothing in the draft at the moment.

Remember having fun doing the profiles on convection and rework, easy with
VPS.

Hope this helps


Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
Tel: (44) 1245 351502
Fax: (44) 1245 496123
Mobile: 07860 775858
 
www.ASKbobwillis.com
 
Book your place on Bob's "Step by Step Failure Analysis Workshop" 14th May
www.ASKbobwillis.com/faworkshops.pdf
 
 New "Printed Board Inspection & Quality Control" 3 July
www.ASKbobwillis.com/PCBworkshop.pdf 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: 15 April 2008 19:22
To: [log in to unmask]
Subject: [TN] SV: [TN] Column Grid Arrays

Don't know if Happy Holden is still at Big Blue/Fishkill. He ought to know a
lot, as being one of the column grid inventors.
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Tan Geok Ang
Skickat: den 15 april 2008 13:23
Till: [log in to unmask]
Ämne: Re: [TN] Column Grid Arrays

I did it once, important thing is that the solder paste volume must have at
least 30% of the column height. If rework is needed, solder paste volume has
to be about that of SMT solder paste printing process.

________________________________

From: TechNet on behalf of Edwin Louis
Sent: Fri 4/11/2008 12:24 AM
To: [log in to unmask]
Subject: [TN] Column Grid Arrays



Does anyone know what specification calls out the board pad
diameter/solder column diameter ratio for column grid arrays and what
the values are?


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