TECHNET Archives

April 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Tue, 15 Apr 2008 20:12:33 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (148 lines)
Why this extreme requirement? BGA's use to be signal processing units, which
is normally maximum 48 VDC. If you mean 250 Volts AFTER the environmental
test and at room conditions, I think it's reasonable, but 250 Volts bias
under test condition is horrible, not to say madness.
/Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Steve Kelly
Skickat: den 15 april 2008 14:42
Till: [log in to unmask]
Ämne: Re: [TN] Possible flux contamination issue

Good Morning,
I need to ask some more questions on this thread. 
One of the reasons our customer went to a water soluble paste was the high
voltage/damp heat test requirement on the finished assembly.
The test requirement is 1000 hours of damp heat test at 85C/85RH. The
voltage requirement is 250 volts. BGA pad spacing is .050. The customer was
concerned about passing this test. 
Regards Steve Kelly

Steve Kelly
PFC Flexible Circuits Limited
PH: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Monday, April 14, 2008 1:58 PM
To: [log in to unmask]
Subject: Re: [TN] Possible flux contamination issue

Thanks everyone for the help. Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: April-11-08 11:50 AM
To: [log in to unmask]
Subject: Re: [TN] Possible flux contamination issue

24 years ago (yes 24!), I gave a paper at InterNepcon, in Brighton, UK, 
entitled "Contamination on Components  and Small Assemblies". I no 
longer have a copy, but I'm fairly sure I evoked the need to have all 
the components supplied clean to avoid just this kind of problem.

Brian

Steve Kelly wrote:
> Good Morning,
> 
> We are assembling a BGA connector onto a flex circuit. The BGA has leaded
> balls and the BGA manufacturer uses a no-clean process to attach the balls
> to the connector and does not clean afterwards. 
> 
> When we assemble the BGA connector to the flex we use water soluble paste
> and then we clean. After damp heat cycling we have seen some shorts. When
we
> take off the connector we see flux residues on the underside of the
> connector but not on the flex.  So my question is - what are the concerns
> about mixing no-clean and water soluble? Is the failure likely due to
> inadequate cleaning or is there something else I should be concerned
about.
> I realize this is probably not the way it should be done but some days you
> just do what the customer wants - good or bad. Thanks in advance. Steve
> Kelly
> 
>  
> 
> Steve Kelly
> 
> (416) 750-8433 (work)
> 
> (416) 750-0016 (fax)
> 
> (416) 577-8433 (cell)
> 
>  
> 
> 
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
> -----------------------------------------------------
> 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2