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April 2008

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Tue, 15 Apr 2008 19:22:48 +0800
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I did it once, important thing is that the solder paste volume must have at least 30% of the column height. If rework is needed, solder paste volume has to be about that of SMT solder paste printing process.

________________________________

From: TechNet on behalf of Edwin Louis
Sent: Fri 4/11/2008 12:24 AM
To: [log in to unmask]
Subject: [TN] Column Grid Arrays



Does anyone know what specification calls out the board pad
diameter/solder column diameter ratio for column grid arrays and what
the values are?


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