Hi Gilbert,
To Richards point, did you measure the Au and Ni thickness at a number of
locations?
John
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Monday, April 14, 2008 7:56 PM
To: [log in to unmask]
Subject: Re: [TN] Non wetting problem
Some quick thoughts before I call it a day?
Br- Possible something from the FR4fire retardant? Dust from routing?
Non-wetting? Well you can plate onto about anything (ie., bronze baby
shoes). Perhaps the gold is thin and dissolves quickly exposing an
unsolderable (highly oxidized) surface beneath?
Rich K / KEJ
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gilbert Min
Sent: Monday, April 14, 2008 9:48 PM
To: [log in to unmask]
Subject: [TN] Non wetting problem
Dear All.
Hope you had a nice weekend.
I got a call from my customer that my PCB has non wetting problem, and
I
received 2 defect samples
I saw the contaminated gold plated surface @ 1st sample, no abnormal
surface
and defects were found @ other sample.
I understand the contaminated gold surface was able to make non wetting
problem, but Another sample, I couldn't find anything on surface.
We did FE-SEM / EDX analysis.
Results: 1st sample: Br, Au, C, O, Au
2nd sample C, O, Au Ion were detected
.
I wonder why Br was detected?, do you have any idea for defection of Br
on
Gold plated surface?.
For 2nd sample, I have no idea, I could not understand the mechanism for
non
wetting problem without any abnormal gold plated surface.
If have idea & possible, would you share your great wisdom to me?
Best Regards / Gilbert Min
Tel.: 82- (0) 11-9242-5340
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