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April 2008

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Subject:
From:
Karl Hunsinger <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karl Hunsinger <[log in to unmask]>
Date:
Wed, 2 Apr 2008 08:14:58 -0400
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I can only answer a few....

  5- When is panel plating suggested and When is pattern plating suggested?

Pattern plating is used on flex circuits with plated through holes. You do not want to panel plate flexible material. That would lend itself to cracked copper. Also, my company has pattern plated rigid material that already has a high copper thickness. (2oz or greater) This gives us better control of the copper etch factor. Thicker copper etches more quickly, so plating it would give us less control.

  6- What is the standard value for annular ring for Pcbs with high copper thicknes (more than 3 oz)?

No standard, but we try to increase our annular ring to above 0.012 of an inch or better because of the etch rate of thick copper.

  7- Is AOI detecting all the PCB defects? What defects are not detected?

Electrical testing (ET)is always a good idea to check that the circuit is performing as the design intended.

  8- Is the automotive market requesting 100% AOI in internal and external layers?

I'm not in the automotive market, but we 100% AOI all inner layers of all of our products. (We make defense products, missile circuits. Also aerospace applications).

  19- Is the automotive market requesting PEA packaging (Electrostatic Protected Area)?

My company as a rule uses ESD packaging on assemblies that contain diodes or connectors that contain components. Usually, the customer requests ESD handling, so it's a no brainer. I'd hazard a guess that automotive products/modules contain diodes and ESD handling and packaging would be a good idea.



Regards,


Karl

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