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April 2008

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Subject:
From:
"Cooke, Robert W. (JSC-NT)[SAIC]" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Cooke, Robert W. (JSC-NT)[SAIC]
Date:
Wed, 30 Apr 2008 12:13:46 -0500
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text/plain
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text/plain (79 lines)
Dave,

The basic intent of the requirement is to remove all of the gold plating
from only those surfaces that are to be part of the final solder
termination. 

It is recommended that PTH leads be degolded to a point on the lead
where it can be visually determined that the gold was removed, but the
entire lead does not need to be degolded.

While we've had inspectors try to measure it (the danger in specifying
an actual numeric value) the value of 95% is a visual assessment
(judgment).

Bob




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Reed
Sent: Wednesday, April 30, 2008 9:30 AM
To: [log in to unmask]
Subject: [TN] IPC-J-STD-001D @ 3.9.3 GOLD REMOVAL

Recently a customer asked the following question.
Here is his question.
 
 I do have a question of interpretation for you regarding "gold
removal".  
In section 3.9.3 it states that ".....95% of the surface to be solder
....." 
needs to have gold removed.  Failing to achieve the 95% is considered a
class 
3 defect.   

We are having boards with PIH gold plated leads rejected for not meeting
this 
requirement. 

Part of the problem is making the determination as to where and how the
95% 
is measured. 

Can you clarify for us exactly where the 95% is measured on the lead.
 
Before I reply to this engineer I thought to see if you had any input.


Thanks,
Dave

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