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April 2008

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Subject:
From:
Ken Bloomquist <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Bloomquist <[log in to unmask]>
Date:
Wed, 30 Apr 2008 09:28:36 -0700
Content-Type:
text/plain
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text/plain (48 lines)
Dave,

The way I've always interpreted this is if you have a gold component lead
that is 1" long and you are going to be soldering the bottom .1" of the lead
into the board then .095" needs to have the gold removed.

KennyB
Ext 43-----Original Message-----
From: David Reed [mailto:[log in to unmask]] 
Sent: Wednesday, April 30, 2008 7:30 AM
To: [log in to unmask]
Subject: [TN] IPC-J-STD-001D @ 3.9.3 GOLD REMOVAL

Recently a customer asked the following question.
Here is his question.
 
 I do have a question of interpretation for you regarding "gold removal".  
In section 3.9.3 it states that ".....95% of the surface to be solder
....." 
needs to have gold removed.  Failing to achieve the 95% is considered a
class 
3 defect.   

We are having boards with PIH gold plated leads rejected for not meeting
this 
requirement. 

Part of the problem is making the determination as to where and how the 95% 
is measured. 

Can you clarify for us exactly where the 95% is measured on the lead.
 
Before I reply to this engineer I thought to see if you had any input.


Thanks,
Dave

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