My apologies for not defining the issue clearly. 

The issue is, we are looking at laminating a flex circuit to a concave surface. 
The flex will have capacitive switches on it so voids between the flex and the 
concave surface will cause degraded performance of the switch. We need to 
avoid air bubbles between the flex and the mating surface.

The opposite side of the concave surface is a TALC surface, so no scratches 
or blemishes can be tolerated.

Thanks for the feedback already provided.

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