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April 2008

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Subject:
From:
"Bruce, David (GB - MAV)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bruce, David (GB - MAV)
Date:
Tue, 29 Apr 2008 04:08:02 -0400
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Does anyone know of a software package to perform fatigue life
prediction of solder joints.

 

I need to be able to predict the fatigue life of solder joints under
different thermal cycling and vibration load conditions. The PCB will
usually be FR4, the solder tin/lead, the components everything from
BGA's to chip passives. Ideally I need to provide an estimate on cycles
to failure.

 

We are trying to do a comparison exercise to try and specify the more
reliable component, for example, a chip capacitor in 0805 or 1206, which
one will be more reliable, from a solder joint perspective and by what
order of magnitude? And what would the expected life of the joint be
under different conditions?

 

We need to perform this exercise over a range of different types of
components, using different types of leaded solder and perhaps with
different board thicknesses. Predictive software would be quicker and
easier than empirical experiments.

 

Any ideas?

 

Regards

 

David



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