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April 2008

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Subject:
From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Creswick, Steven
Date:
Wed, 2 Apr 2008 11:32:20 -0400
Content-Type:
text/plain
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text/plain (49 lines)
Brian,

Taking Ingemar's valid comments to heart, could you seal the assembly in
a bag, THEN place it into a PRESSURE chamber.  Somewhat like laminating
LTCC

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Chandler
Sent: Wednesday, April 02, 2008 10:01 AM
To: [log in to unmask]
Subject: [TN] Vacuum Assembly

Anyone have experience with using vacuum assembly to attach a flex
circuit
to a concave surface using adhesive without voids? Any insight into this
process would be appreciated.

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