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Date: | Tue, 1 Apr 2008 16:14:01 +0200 |
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Is there someone who wants to answer my questions?
Best regards.
----- Original Message -----
From: SAHLI habib
To: [log in to unmask]
Sent: Thursday, March 20, 2008 1:01 PM
Subject: Various questions
Dear Technetters,
Can I have the privelege to get brief answers to all my following questions :
1- Main copper thickness used in Automotive market?
2- Does Automotive market is asking for copper thickness reduction?
3- What is the standard maximum and minimum bow and twist for Pcbs with BGA components?
4- What is the standard tolerance for press-fit PTH?
5- When is panel plating suggested and When is pattern plating suggested?
6- What is the standard value for annular ring for Pcbs with high copper thicknes (more than 3 oz)?
7- Is AOI detecting all the PCB defects? What defects are not detected?
8- Is the automotive market requesting 100% AOI in internal and external layers?
9- What the is the maximum offset between copper and solder mask requested in the automotive market?
10- What the is the maximum offset between copper,solder mask and holes requested in the automotive market?
11- What is the main surface finish for Automotive?
12- What product application is used OSP for?
13- What product application is used ENIG for?
14- What product application is used Immersion Silver for?
15- Is Screen printing in use for Automotive market?
16- Is Screen printing used to mark code matrix?
17- What is the maximum accepted value of Ionic contamination in Automotive market. (µg Na Cl/square for inch)
18- Are customers requesting Ioni chromatography or any other similar analysis?
19- Is the automotive market requesting PEA packaging (Electrostatic Protected Area)?
20- Is Pollution gas test required for Automotive market?
21- What are the Significant Characteristics defined by Automotive market?
22- What are the main characteristics for satndard FR4 base material?
23- What are the main characteristics for lead free base material?
Thank you in advance for your support.
Habib
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